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Heat Sink Paste - Thermal Compound 10gms box

SKU: SMW4W9BEBE
The Heat Sink Paste Thermal Compound (10g Box) is a high-performance thermal interface material designed to improve heat transfer between electronic components and heat sinks. By filling microscopic air gaps between surfaces, the thermal compound significantly reduces thermal resistance and enhances cooling efficiency. This thermal paste is widely used with processors, power transistors, voltage regulators, MOSFETs, LEDs, power modules, and...
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Orders placed before 3 PM IST will be shipped on the same day (excluding Sundays and Public holidays) through our shipping partners. In rare cases, the pickup may get delayed during Public holidays / Bandh / Environmental disturbances.

Specifications

Specifications:

Product Type: Thermal Compound / Heat Sink Paste
Net Weight: 10g
Color: White
Base Material: Silicone-Based Thermal Compound
Thermal Conductivity: Typical 0.8 – 1.5 W/m·K
Electrical Conductivity: Non-Conductive
Thermal Resistance: Low
Consistency: Smooth Paste
Operating Temperature Range: -50°C to +200°C
Application Method: Manual Spreading
Corrosion Resistance: Yes
Drying Type: Non-Drying
Shelf Life: Long-Term Storage Stable
Packaging Type: Plastic Box / Container
Compatibility:
CPUs
Power Transistors
Voltage Regulators
MOSFETs
LEDs
Heat Sinks

Additional Resources

Thermal Compound.PDF

FAQ

1. What is thermal compound used for?

Thermal compound is used to improve heat transfer between electronic components and heat sinks by filling microscopic air gaps between their surfaces.

2. Where can this heat sink paste be applied?

It can be used on CPUs, power transistors, MOSFETs, voltage regulators, LEDs, amplifiers, and other heat-generating components.

3. Is the thermal compound electrically conductive?

No, the thermal compound is typically electrically non-conductive, making it safe for use around electronic components.

4. Why is thermal paste important when mounting a heat sink?

Without thermal paste, air gaps between the component and heat sink reduce heat transfer efficiency. Thermal compound improves thermal contact and enhances cooling performance.

5. How much thermal compound should be applied?

Only a thin, uniform layer is required to fill surface imperfections and ensure efficient heat transfer between the component and heat sink.

View full product details

The Heat Sink Paste Thermal Compound (10g Box) is a high-performance thermal interface material designed to improve heat transfer between electronic components and heat sinks. By filling microscopic air gaps between surfaces, the thermal compound significantly reduces thermal resistance and enhances cooling efficiency.

This thermal paste is widely used with processors, power transistors, voltage regulators, MOSFETs, LEDs, power modules, and other heat-generating electronic components. Its smooth consistency ensures easy application and uniform coverage, helping to maintain optimal operating temperatures and improve component reliability.

Packaged in a convenient 10g container, the thermal compound is suitable for electronics repair, maintenance, industrial applications, and DIY projects where effective heat dissipation is essential.

Key Features

  • High-performance thermal interface compound
  • Improves heat transfer efficiency
  • Reduces thermal resistance between surfaces
  • Fills microscopic air gaps effectively
  • Suitable for CPUs, transistors, MOSFETs, and regulators
  • Easy to apply and spread
  • Non-corrosive formulation
  • Stable performance over a wide temperature range
  • Helps prevent overheating
  • Enhances heat sink effectiveness
  • Long-lasting thermal conductivity
  • Suitable for electronics repair and assembly
  • Convenient 10g packaging
  • Ideal for professional and DIY applications